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Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells

  • This article gives a summary of the 8th Metallization and Interconnection workshop and attempts to place each contribution in the appropriate context. The field of metallization and interconnection continues to progress at a very fast pace. Several printing techniques can now achieve linewidths below 20 μm. Screen printing is more than ever the dominating metallization technology in the industry, with finger widths of 45 μm in routine mass production and values below 20 μm in the lab. Plating technology is also being improved, particularly through the development of lower cost patterning techniques. Interconnection technology is changing fast, with introduction in mass production of multiwire and shingled cells technologies. New models and characterization techniques are being introduced to study and understand in detail these new interconnection technologies.

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Metadaten
Author:Guy Beaucarne, Gunnar Schubert, Loic Tous, Jaap Hoornstra
DOI:https://doi.org/10.1063/1.5125866
ISBN:978-0-7354-1901-8
Parent Title (English):8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells, May 13-14, 2019, Konstanz, Germany ; (AIP Conference Proceedings 2156, 020001)
Publisher:AIP Publishing
Document Type:Conference Proceeding
Language:English
Year of Publication:2019
Release Date:2020/01/28
Tag:Interconnection; Metallization; Photovoltaics; Silicon; Solar Cells
First Page:020001-1
Last Page:020001-13
Note:
Volltextzugriff für Angehörige der Hochschule Konstanz möglich.
Institutes:Fakultät Elektrotechnik und Informationstechnik
Relevance:Keine peer reviewed Publikation (Wissenschaftlicher Artikel und Aufsatz, Proceeding, Artikel in Tagungsband)
Open Access?:Nein
Licence (English):License LogoLizenzbedingungen AIP