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This paper introduces the concept of Universal Memory Automata (UMA) and automated compilation of Verilog Hardware Description Language (HDL) code at Register Transfer Level (RTL) from UMA graphs for digital designs. The idea is based on the observation that Push Down Automata (PDA) are able to process the Dyk-Language - commonly known as the balanced bracket problem - with a finite set of states while Finite State Machines (FSM) require an infinite set of states. Since infinite sets of states are not applicable to real designs, PDAs appear promising for types of problems similar to the Dyk-Language. PDAs suffer from the problem that complex memory operations need to be emulated by a specific stack management. The presented UMA therefore extends the PDA by other types of memory, e.g. Queue, RAM or CAM. Memories that are eligible for UMAs are supposed to have at least one read and one write port and a one-cycle read/write latency. With their modified state-transfer- and output-function, UMAs are able to operate user-defined numbers, configurations and types of memories. Proof of concept is given by an implementation of a cache coherency protocol, i.e. a practical problem in microprocessor design.
This paper summarizes the trends in metallization and interconnection technology in the eyes of the participants of the 8th Metallization and Interconnection Workshop. Participants were asked in a questionnaire to share their view on the future development of metallization technology, the kind of metal used for front side metallization and the future development of interconnection technology. The continuous improvement of the screen-printing technology is reflected in the high expected percentage share decreasing from 88% in three years to still 70% in ten years. The dominating front side metal in the view of the participants will be silver with an expected percentage share of nearly 70% in 2029. Regarding interconnection technologies, the experts of the workshop expect new technologies to gain significant technology shares faster. Whereas in three years soldering on busbars is expected to dominate with a percentage share of 71% it will drop in ten years to 35% in the eyes of the participants. Multiwire and shingling technologies are seen to have the highest potential with expected percentage shares of 33% (multiwire) and 16% (shingling) in ten years.
SyNumSeS is a Python package for numerical simulation of semiconductor devices. It uses the Scharfetter-Gummel discretization for solving the one dimensional Van Roosbroeck system which describes the free electron and hole transport by the drift-diffusion model. As boundary conditions voltages can be applied to Ohmic contacts. It is suited for the simulation of pn-diodes, MOS-diodes, LEDs (hetero junction), solar cells, and (hetero) bipolar transistors.
Summary of the 9th workshop on metallization and interconnection for crystalline silicon solar cells
(2021)
The 9th edition of the Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells was held as an online event but nevertheless reached the workshop goals of knowledge sharing and networking. The technology of screen-printed contacts of high temperature pastes continues its fast progress enabled by better understanding of the phenomena taking place during printing and firing, and progress in materials. Great improvements were also achieved in low temperature paste printing and plated metallization. In the field of interconnection, progress was reported on multiwire approaches, electrically conductive adhesives and on foil-based approaches. Common to many contributions at the workshop was the use of advanced laser processes to improve performance or throughput.
Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells
(2019)
This article gives a summary of the 8th Metallization and Interconnection workshop and attempts to place each contribution in the appropriate context. The field of metallization and interconnection continues to progress at a very fast pace. Several printing techniques can now achieve linewidths below 20 μm. Screen printing is more than ever the dominating metallization technology in the industry, with finger widths of 45 μm in routine mass production and values below 20 μm in the lab. Plating technology is also being improved, particularly through the development of lower cost patterning techniques. Interconnection technology is changing fast, with introduction in mass production of multiwire and shingled cells technologies. New models and characterization techniques are being introduced to study and understand in detail these new interconnection technologies.
Since its first edition in 2008, the Workshop on Metallization and Interconnection for Crystalline Silicon SolarCells has been a key event where knowledge in the critical fields of crystalline silicon solar cell metallization andinterconnection is shared between experts from academia and industry. It has become a highly recognized event forthe quality of the contributions, the lively Q&A sessions, and the exceptional networking opportunity.The situation with the Covid-19 pandemic made organizing the 9th edition as an in-person event impossible andforced us to reconsider the event format. The event took place virtually on October 5th and 6th 2020. We used aninnovative online platform that enabled not only presentations followed by Q&A but also more informal interactions,where participants could see and talk directly to other participants. 120 experts from 22 countries took part andattended 21 contributions presented live. In spite of a few technical glitches, the workshop was successful and thegoals of exchanging on the state-of-the-art in research/industry and connecting experts in the field were achieved.All presentations are available on www.miworkshop.info as .pdf documents. These proceedings contain asummary of the 9th edition (MIW2020) and peer-reviewed papers based on the workshop contributions. The organizerswish to thank the members of the Scientific Committee for the time spent reviewing the MIW2020 abstracts andproceedings. The organizers also wish to thank again the sponsors and supporters for their financial contributionswhich made the 9th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells possible.
Some 165 global experts and specialists from industry and academic institutes met at the 8th Metallization & Interconnection Workshop (MIW2019) that took place from 13 to 14 May 2019 in Konstanz, Germany. Participants from 19 countries debated results of 28 oral and 11 poster presentations.
All presentations are available on www.metallizationworkshop.info as pdf documents. As in previous editions, lots of room was available for discussions and networking during the two-days program which included panel and market-place discussions as well as social events (reception, workshop dinner).
These proceedings contain: a summary of the oral and poster presentations, the results of the survey conducted during the workshop, and peer-reviewed papers based on workshop contributions.
In this paper, we propose a novel method for real-time control of electric distribution grids with a limited number of measurements. The method copes with the changing grid behaviour caused by the increasing number of renewable energies and electric vehicles. Three AI based models are used. Firstly, a probabilistic forecasting estimates possible scenarios at unobserved grid nodes. Secondly, a state estimation is used to detect grid congestion. Finally, a grid control suggests multiple possible solutions for the detected problem. The best countermeasures are then detected by evaluating the systems stability for the next time-step.