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Vortrag und Abstract
Some 165 global experts and specialists from industry and academic institutes met at the 8th Metallization & Interconnection Workshop (MIW2019) that took place from 13 to 14 May 2019 in Konstanz, Germany. Participants from 19 countries debated results of 28 oral and 11 poster presentations.
All presentations are available on www.metallizationworkshop.info as pdf documents. As in previous editions, lots of room was available for discussions and networking during the two-days program which included panel and market-place discussions as well as social events (reception, workshop dinner).
These proceedings contain: a summary of the oral and poster presentations, the results of the survey conducted during the workshop, and peer-reviewed papers based on workshop contributions.
This paper summarizes the trends in metallization and interconnection technology in the eyes of the participants of the 8th Metallization and Interconnection Workshop. Participants were asked in a questionnaire to share their view on the future development of metallization technology, the kind of metal used for front side metallization and the future development of interconnection technology. The continuous improvement of the screen-printing technology is reflected in the high expected percentage share decreasing from 88% in three years to still 70% in ten years. The dominating front side metal in the view of the participants will be silver with an expected percentage share of nearly 70% in 2029. Regarding interconnection technologies, the experts of the workshop expect new technologies to gain significant technology shares faster. Whereas in three years soldering on busbars is expected to dominate with a percentage share of 71% it will drop in ten years to 35% in the eyes of the participants. Multiwire and shingling technologies are seen to have the highest potential with expected percentage shares of 33% (multiwire) and 16% (shingling) in ten years.
Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells
(2019)
This article gives a summary of the 8th Metallization and Interconnection workshop and attempts to place each contribution in the appropriate context. The field of metallization and interconnection continues to progress at a very fast pace. Several printing techniques can now achieve linewidths below 20 μm. Screen printing is more than ever the dominating metallization technology in the industry, with finger widths of 45 μm in routine mass production and values below 20 μm in the lab. Plating technology is also being improved, particularly through the development of lower cost patterning techniques. Interconnection technology is changing fast, with introduction in mass production of multiwire and shingled cells technologies. New models and characterization techniques are being introduced to study and understand in detail these new interconnection technologies.
We present an innovative decision support system (DSS) for distribution system operators (DSO) based on an artificial neural network (ANN). A trained ANN has the ability to recognize problem patterns and to propose solutions that can be implemented directly in real time grid management. The principle functionality of this ANN based optimizer has been demonstrated by means of a simple virtual electrical grid. For this grid, the trained ANN predicted the solution minimizing the total line power dissipation in 98 percent of the cases considered. In 99 percent of the cases, a valid solution in compliance with the specified operating conditions was found. First ANN tests on a more realistic grid, calibrated with household load measurements, revealed a prediction rate between 88 and 90 percent depending on the optimization criteria. This approach promises a faster, more cost-efficient and potentially secure method to support distribution system operators in grid management.