Refine
Year of publication
- 2019 (2)
Document Type
Language
- English (2)
Has Fulltext
- no (2)
Keywords
- Interconnection (2)
- Metallization (2)
- Photovoltaics (2)
- Silicon (2)
- Solar Cells (2)
Institute
- Fakultät Elektrotechnik und Informationstechnik (2) (remove)
This paper summarizes the trends in metallization and interconnection technology in the eyes of the participants of the 8th Metallization and Interconnection Workshop. Participants were asked in a questionnaire to share their view on the future development of metallization technology, the kind of metal used for front side metallization and the future development of interconnection technology. The continuous improvement of the screen-printing technology is reflected in the high expected percentage share decreasing from 88% in three years to still 70% in ten years. The dominating front side metal in the view of the participants will be silver with an expected percentage share of nearly 70% in 2029. Regarding interconnection technologies, the experts of the workshop expect new technologies to gain significant technology shares faster. Whereas in three years soldering on busbars is expected to dominate with a percentage share of 71% it will drop in ten years to 35% in the eyes of the participants. Multiwire and shingling technologies are seen to have the highest potential with expected percentage shares of 33% (multiwire) and 16% (shingling) in ten years.
Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells
(2019)
This article gives a summary of the 8th Metallization and Interconnection workshop and attempts to place each contribution in the appropriate context. The field of metallization and interconnection continues to progress at a very fast pace. Several printing techniques can now achieve linewidths below 20 μm. Screen printing is more than ever the dominating metallization technology in the industry, with finger widths of 45 μm in routine mass production and values below 20 μm in the lab. Plating technology is also being improved, particularly through the development of lower cost patterning techniques. Interconnection technology is changing fast, with introduction in mass production of multiwire and shingled cells technologies. New models and characterization techniques are being introduced to study and understand in detail these new interconnection technologies.