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Summary of the 9th workshop on metallization and interconnection for crystalline silicon solar cells
(2021)
The 9th edition of the Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells was held as an online event but nevertheless reached the workshop goals of knowledge sharing and networking. The technology of screen-printed contacts of high temperature pastes continues its fast progress enabled by better understanding of the phenomena taking place during printing and firing, and progress in materials. Great improvements were also achieved in low temperature paste printing and plated metallization. In the field of interconnection, progress was reported on multiwire approaches, electrically conductive adhesives and on foil-based approaches. Common to many contributions at the workshop was the use of advanced laser processes to improve performance or throughput.
Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells
(2019)
This article gives a summary of the 8th Metallization and Interconnection workshop and attempts to place each contribution in the appropriate context. The field of metallization and interconnection continues to progress at a very fast pace. Several printing techniques can now achieve linewidths below 20 μm. Screen printing is more than ever the dominating metallization technology in the industry, with finger widths of 45 μm in routine mass production and values below 20 μm in the lab. Plating technology is also being improved, particularly through the development of lower cost patterning techniques. Interconnection technology is changing fast, with introduction in mass production of multiwire and shingled cells technologies. New models and characterization techniques are being introduced to study and understand in detail these new interconnection technologies.
This paper summarizes the trends in metallization and interconnection technology in the eyes of the participants of the 8th Metallization and Interconnection Workshop. Participants were asked in a questionnaire to share their view on the future development of metallization technology, the kind of metal used for front side metallization and the future development of interconnection technology. The continuous improvement of the screen-printing technology is reflected in the high expected percentage share decreasing from 88% in three years to still 70% in ten years. The dominating front side metal in the view of the participants will be silver with an expected percentage share of nearly 70% in 2029. Regarding interconnection technologies, the experts of the workshop expect new technologies to gain significant technology shares faster. Whereas in three years soldering on busbars is expected to dominate with a percentage share of 71% it will drop in ten years to 35% in the eyes of the participants. Multiwire and shingling technologies are seen to have the highest potential with expected percentage shares of 33% (multiwire) and 16% (shingling) in ten years.