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Ziel der Masterarbeit war es, die Feuchtigkeitseigenschaften von Estrichen bei unterschiedlichen Klimaten mithilfe von Sorptionsisothermen zu charakterisieren. Die wenigen Literaturangaben zu Sorptionsisothermen von mineralischen Estrichen beziehen sich im Wesentlichen auf Calciumsulfatestriche und genormte Zementestriche (ohne dass die Zementart: Portlandzemente, Hochofenzemente bzw. CEM I, CEM II, CEM III etc. unterschieden werden) und i.d.R. nur auf eine Lufttemperatur (= 20 Grad C). Anliegen der Arbeit war es, zusätzlich die seit ca. 20 Jahren marktüblichen ternären Schnellzemente mit zu untersuchen und die baupraktisch interessanten Temperaturen von 15 Grad C und 25 Grad C einzubeziehen. Ebenso wurden die Auswirkungen der Klimabedingung auf der Baustelle (Jahreszeit, Luftfeuchtigkeit, Temperatur) auf den Hydratationsvorgang der Estriche untersucht. Dabei wurden jeweils nicht nur ein Vertreter der verschiedenen Bindemittelsysteme, sondern mindestens zwei verschiedene Estriche unterschiedlicher Hersteller mit einbezogen. In Kombination mit den Ergebnissen der Gefügeuntersuchungen (u. a. Hg-Porosametrie) wird belegt, weshalb sich die zement- und schnellzementgebundenen Estriche vollkommen anders verhalten als die calciumsulfatgebundenen Estriche. Dieses unterschiedliche Verhalten ist auch einer der Gründe, warum Estriche mit der KRL-Methode in Bezug auf ihren Feuchtegehalt nicht bewertet werden können. Aus diesem Grund folgt ein Vergleich der Materialfeuchtemessungen "KRL-Methode" mit der handwerksüblichen und seit Jahrzehnten in der Praxis bewährten "CM-Methode".
This PhD investigation lies at the intersection of Architecture, Textile Design and Interaction Design and speculates about sustainable forms of future living, focussing on bionic principles to create alternative lightweight building structures with textiles and digital fabrication techniques. In an interdisciplinary, practice- based design approach, informed by radical case studies from the 1960s to 80s on soft architectures like Archigram, Buckminster Fuller, Cedric Price, or Yona Friedman and critical theory on new materialism, (D. Haraway 1997, K. Barad 1998, J. Bennett 2007) sociological, philosophical (B. Latour 2005, G.Deleuze F., Guattari F 1987) and phenomenological thinkers (L. Malafouris 2005, J.Rancière 2004, B. Massumi 2002, N. Bourriaud 2002 , M. Merleau-Ponty 1963) this research investigates the cultural and social rootedness (Verortung) of novel materials and technologies, exploring in between prosthetic relations between the body and the environment.
Generative Design Software - How does digitalization change the professional profile of architects
(2019)
Abstract, Poster und Vortrag
Engineering and management
(2019)
The reliable supply of energy is an essential prerequisite for the economic success of a country. Questions of sustainability and the replacement of import dependencies require new tasks with new approaches. This contribution provides an overview of dependencies using the example of German electrical power grids integrating renewable energies. Aspects of energy trading and grid stability are brought into connection, stock exchange trading, grid codes and volatility of used primary energies are discussed.
Vortrag und Abstract
Some 165 global experts and specialists from industry and academic institutes met at the 8th Metallization & Interconnection Workshop (MIW2019) that took place from 13 to 14 May 2019 in Konstanz, Germany. Participants from 19 countries debated results of 28 oral and 11 poster presentations.
All presentations are available on www.metallizationworkshop.info as pdf documents. As in previous editions, lots of room was available for discussions and networking during the two-days program which included panel and market-place discussions as well as social events (reception, workshop dinner).
These proceedings contain: a summary of the oral and poster presentations, the results of the survey conducted during the workshop, and peer-reviewed papers based on workshop contributions.
This paper summarizes the trends in metallization and interconnection technology in the eyes of the participants of the 8th Metallization and Interconnection Workshop. Participants were asked in a questionnaire to share their view on the future development of metallization technology, the kind of metal used for front side metallization and the future development of interconnection technology. The continuous improvement of the screen-printing technology is reflected in the high expected percentage share decreasing from 88% in three years to still 70% in ten years. The dominating front side metal in the view of the participants will be silver with an expected percentage share of nearly 70% in 2029. Regarding interconnection technologies, the experts of the workshop expect new technologies to gain significant technology shares faster. Whereas in three years soldering on busbars is expected to dominate with a percentage share of 71% it will drop in ten years to 35% in the eyes of the participants. Multiwire and shingling technologies are seen to have the highest potential with expected percentage shares of 33% (multiwire) and 16% (shingling) in ten years.
Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells
(2019)
This article gives a summary of the 8th Metallization and Interconnection workshop and attempts to place each contribution in the appropriate context. The field of metallization and interconnection continues to progress at a very fast pace. Several printing techniques can now achieve linewidths below 20 μm. Screen printing is more than ever the dominating metallization technology in the industry, with finger widths of 45 μm in routine mass production and values below 20 μm in the lab. Plating technology is also being improved, particularly through the development of lower cost patterning techniques. Interconnection technology is changing fast, with introduction in mass production of multiwire and shingled cells technologies. New models and characterization techniques are being introduced to study and understand in detail these new interconnection technologies.